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Kurt J. Lesker – High Vacuum Systems

NANO 36

Affordable Glove Box Integrated Sputtering, Thermal or Low Temperature Evaporation System

Magnetron Sputtering Sources3
Thermal Evaporation Sources4
Low Temperature Evaporation Sources (LTE)4
Electron Beam SourceN/A
Platen

150mm Substrates

  • Heating Up to 350°C
  • Water-Cooling
Load LockN/A
SoftwareFull eKLipse™ Control Software/Hardware Suite

 

PRO Line PVD 75

Modular Design, Allowing Countless Configurations & Multiple Techniques in the Same Chamber

Magnetron Sputtering Sources6
Thermal Evaporation Sources4
Low Temperature Evaporation Sources (LTE)2
Electron Beam SourceMulti Pocket, 5kW or 10kW Power Supplies
Platen

150mm Substrates

  • Heating Up to 800°C
  • Water-Cooling
  • RF Bias
Load LockSingle or Multi-Cassette
SoftwareFull eKLipse™ Control Software/Hardware Suite

 

PRO Line PVD 200

Larger Version of the PVD 75 Allowing More Ssources & Configurations

Magnetron Sputtering Sources8
Thermal Evaporation Sources6
Low Temperature Evaporation Sources (LTE)2
Electron Beam SourceMulti Pocket, 5kW or 10kW Power Supplies
Platen

200mm Substrates

  • Heating Up to 800°C
  • Water-Cooling
  • RF Bias
Load LockSingle or Multi-Cassette
SoftwareFull eKLipse™ Control Software/Hardware Suite

 

AXXIS

Radial Deposition Ports & a Right-Angled Tilting Substrate Stage Facilitates Multiple Deposition Techniques

Magnetron Sputtering Sources6
Thermal Evaporation Sources3
Low Temperature Evaporation Sources (LTE)N/A
Electron Beam SourceMulti Pocket, 5kW or 10kW Power Supplies
Platen

Tilting Fixture 200mm Substrates

  • Heating Up to 550°C
  • Water-Cooling
  • Glow Discharge
Load LockSingle
SoftwareFull eKLipse™ Control Software/Hardware Suite

 

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